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: rd-059a ?????? specification spec. no. spe-w-003 rev b (2.6) date april 13 th , 2009 product name GM9601 approved checked prepared dcc issue name f ?x
copyright ? 2008 ampak technology co, ltd. all rights reserved. GM9601 802.11 b/g wireless lan module datasheet revision 2.6 april 2009
ampak technology proprietary & confidential information 2 contents 1. introduction.............................................................................................................. 3 2. features .................................................................................................................... 3 3. interface ................................................................................................................... 4 3-1 form factor ........................................................................................................ 4 3-2 pin definition .................................................................................................... 5 3-3 sdio protocol timing....................................................................................... 7 3-4 reset and configuration timing ??.?.??..????????????8 3-5 spi host interface timing ????.????????????????8 4. product specification ............................................................................................... 9 4-1 general specification ........................................................................................ 9 4-2 power consumption .........................................................................................11 4-3 supply voltage ..................................................................................................11 5. reliability test ....................................................................................................... 12 6. regulatory.............................................................................................................. 12 7. mechanical specification....................................................................................... 13 8. recommended reflow profile............................................................................... 14 9. recommended footprint........................................................................................ 15 10. package information .............................................................................................. 16 10-1 tray dimension ............................................................................................. 16 10-2 packing dimension........................................................................................ 17 10-3 inner box ....................................................................................................... 18 10-4 msl level / st orage condition..................................................................... 19 10-5 manufacture site ???????????????????????19
ampak technology proprietary & confidential information 3 1. introduction ampak technology co., ltd. introduces a low- cost and low-power consumption module which combines wifi functions. th e highly integrated module allows the usage of web browsing, voip, and headset applications. the wireless sip supports ieee 802.11 b/g sta ndard and it can provide up to 54mbps for ieee 802.11g , or 11mbps for ieee 802.11b to connect your wireless lan. wlan interfaces to the host sy stem via the sdio interface. 2. features z small form factor: 8.8mm x 8.8mm x 1.45mm z 802.11i (aes, tkip, 802.1x) compliant and wep (64/128 bits) z windows ce/linux driver support z no external clock source required z sdio (1bit/4bit) / spi interface z rohs complaint / lead free a simplified block diagram of the modul e is depicted in the figure below.
ampak technology proprietary & confidential information 4 3. interface 3-1 form factor component lead element: immersion gold unit: mm tolerance: +/- 0.1mm
ampak technology proprietary & confidential information 5 3-2 pin definition no. terminal name pin ty pe i/o type description 1 sd_dat [1] sdio i/o sdio 4-bit mode: data line bit [1] sdio 1-bit mode: interrupt(active low) sdio spi mode : interrupt(active low) 2 sd_dat [3] sdio i/o sdio 4-bit mode: data line bit [3] sdio spi mode : card select ( active low) 3 resetn config i reset (active low) 4 vdd_host_io vdd3.3 power host i/f voltage: 3.3vconnect to 3.3v power supply need 1uf decoupling capacitor 5 sd_dat [2] sdio i/o sdio 4-bit mode: data line bit [2] sdio 1-bit mode :read wait 6 sd_dat [0] sdio i/o sdio 4-bit mode: data line bit [0] sdio 1-bit mode: data line sdio spi mode :data output 7 sd_clk sdio i/o sdio 4-bit mode: clock input sdio 1-bit mode: clock input sdio spi mode: clock input 8 sd_cmd sdio i/o sdio 4-bit mode: command / response sdio 1-bit mode: command line sdio spi mode: data input 9 gpio [4] gpio i/o general i/o port 10 vdd1.8 vdd1.8 power 1.8v terminal, need 1uf decoupling capacitor 11 vdd1.2 vdd o for internal 1.2v power supply; need 1uf decoupling capacitor 12 if_sel_1 config o select interface mode : sdio mode: no connect *reserved one off-sip 100kohm resister to ground is needed for g-spi interface selection based on marvell 8686 b2 silicon
ampak technology proprietary & confidential information 6 13 if_sel_2 config o select interface mode : sdio mode: no connect *reserved one off-sip 100kohm resister to ground is needed for g-spi interface selection based on marvell 8686 b2 silicon 14 vdd1.8 vdd1.8 power 1.8v terminal, need 1uf decoupling capacitor 15 gnd gnd ground connect to gnd 16 vdd3.3 vdd3.3 power connect to 3.3v power 17 ecsn config i no connect for host interface bus (default) *sw options after boot rom reserved one off-sip 100kohm resister ground is needed for booting interface selection. 18 vdd1.8 vdd1.8 power 1.8v terminal, need 1uf decoupling capacitor 19 sclk config i no connect for host interface bus (default) *sw options after boot rom. reserved one off-sip 100kohm resister ground is needed for booting interface selection. 20 gnd gnd ground connect to gnd 21 gnd gnd ground connect to gnd 22 vdd_3.3v_pa vdd3.3 power connect to 3.3v power need 1uf decoupling capacitor 23 gnd gnd ground connect to gnd 24 vdd_3.3v_pa vdd3.3 power connect to 3.3v power need 1uf decoupling capacitor 25 gnd gnd ground connect to gnd 26 vdd_3.3v_pa vdd3.3 power connect to 3.3v power need 1uf decoupling capacitor 27 gnd gnd ground connect to gnd 28 vdd_3.3v_pa vdd3.3 power connect to 3.3v power need 1uf decoupling capacitor
ampak technology proprietary & confidential information 7 29 gnd gnd ground connect to gnd 30 gnd gnd ground connect to gnd 31 gnd gnd ground connect to gnd 32 gnd gnd ground connect to gnd 33 ant ant o (rf) ant port (50ohm) 34 gnd gnd ground connect to gnd 35 gnd gnd ground connect to gnd 36 vdd1.8 vdd1.8 power 1.8v terminal, need 1uf decoupling capacitor 3-3 sdio protocol timing sdio protocol timing diagram* sdio protocol timing diagram- high speed mode* * reference from the marvell 88w8686 datasheet
ampak technology proprietary & confidential information 8 500us tp 1us ampak technology proprietary & confidential information 9 4. product specification 4-1 general specification product name 802.11b/g wireless lan module dimensions 8.8 x 8.8 x 1.45 mm (tolerance: +/- 0.1mm) host interface sdio 4-bit/1-bit / spi modulation connection 36 pin lga frequency band 802.11b ism band 2.400 ~ 2.484ghz (subjec t to local regulations) 802.11g ism band 2.400 ~ 2.484ghz (subjec t to local regulations) number of channel 802.11b usa and canada ? 11 most european countries ? 13 japan ? 14 france ? 4 802.11g usa and canada ? 13 most european countries ? 13 japan ? 13 operating voltage 3.3v +/- 10 % 1.8v+/- 5% spreading 802.11b direct sequence spread spectrum (dsss) 802.11g orthogonal frequency division multiplexing (ofdm) modulation 802.11g 64 qam, 16 qam,qpsk, bpsk 802.11b cck,dqpsk,dbpsk data rate 802.11b 11,5.5, 2, 1 mbps per channel, auto fallback for extended range 802.11g 54, 48, 36,24,18,12, 9, 6 mbps per channel, auto fallback for extended range transmitted rf power 802.11b please see the output power ta ble for detail. tolerance: +/-1.5dbm 802.11g please see the output power ta ble for detail. tolerance: +/-1.5dbm
ampak technology proprietary & confidential information 10 receive sensitivity 802.11g nominal temp range: - 6mbps per<10% @ -82 dbm, +/- 2 dbm - 9mbps per<10% @ -81 dbm, +/- 2 dbm - 12mbps per<10% @ -80 dbm, +/- 2 dbm - 18mbps per<10% @ -79 dbm, +/- 2 dbm - 24mbps per<10% @ -77 dbm, +/- 2 dbm - 36mbps per<10% @ -74 dbm, +/- 2 dbm - 48mbps per<10% @ -72 dbm, +/- 2 dbm - 54mbps per<10% @ -70 dbm, +/- 2 dbm 802.11b - 11mbps per<8% @ ?85 dbm +/- 2 dbm - 5.5mbps per<8% @ ?87 dbm +/- 2 dbm - 2mbps per<8% @ ?88 dbm +/- 2 dbm - 1mbps per<8% @ ?89 dbm +/- 2 dbm maximum receive level - 10dbm supplied driver windows xp/vista, win ce 5.0, linux 2.6 standards ieee 802.11b, ieee 802.11g standard, wi-fi compliant temperature range -10 ~ 65c (operating); -40 ~ 85c (storage) humidity operating humidity 10% to 95% non-condensing storage humidity 5% to 95% non-condensing rf output power table [dbm] setting in 802.11g ch 2412 mhz 2417~2467mhz 2472 mhz remark 6~24 mbps 13 13 13 36 mbps 13 13 13 48 mbps 13 13 13 54mbps 13 13 13 rf output power table [dbm] setting in 802.11b ch 2412 mhz 2417~2467mhz 2472 mhz remark 1 mbps 13 13 13 2mbps 13 13 13 5.5mbps 13 13 13 11mbps 13 13 13
ampak technology proprietary & confidential information 11 4-2 power consumption the power consumption is typically measured at ta =25c. test mode 3.3v rail 1.8v rail remark 802.11g continue tx@54mbps,13dbm 185 ma 152 ma 99% duty cycle 802.11b continue tx@11mbps,13 dbm 185 ma 145 ma 99% duty cycle 802.11g rx@54mbps 0.2 ma 192 ma 802.11b rx@11mbps 0.2 ma 164 ma 802.11b/g rx idle 0.2 ma 130 ma deep sleep mode 0.4 ma 4-3 supply voltage symbol parameter min typ max unit vdd3.3 pa , i/o analog power supply 3.0 3.3 3.6 v vdd1.8 1.8v analog power supply , internal 1.2v_ldo 1.7 1.8 1.9 v config resetn,if_sel_1,if_sel_2,ecsn,sclk 2.97 3.3 3.63 v sdio sdio host interface 2.97 3.3 3.63 v gpio general purpose i/o 2.97 3.3 3.63 v note : power supply voltage with respect to ground.
ampak technology proprietary & confidential information 12 5. reliability test no item test condition. characteristics 1 thermal shock test -25 for 10mins 100 for 10mins check point:150/250/500cycle no electrical problem 2 temperature cycle test -40 for 15mins 100 for 15mins transfer rate: 15 per min check point: 158/263/421/526cycle no electrical problem 3 high /low temperature storage test power off 80 for 10hr;-40 for 10hr; room temperature for 6h no electrical problem 4 high/low temperature operation test power on, -20 , for 10hr; 80 for 10hr room temperature for 6hr no electrical problem 5 temperature humidity biased/ operation test power on 25 /50%/30min; 80 /85%/200hr;25 /50%/30min no electrical problem 6 operation & voltage test voltage:3.0v,3.3v,3.6v temperature:0 , 45 , 80 , retention time:15min no electrical problem 7 random vibration test power on, 3.5g rms, 10 mins 5hz @ 0.01g2/hz to 20 hz @ 0.025g2/hz 20 hz @ 0.025g2/hz to 500 hz@ 0.025g2/hz no electrical problem 8 esd esd-mm:jedec eia/jesd22-a115-a esd-hbm:mil-std-883g no electrical problem 9 mechanical shock test 1. sine wave 230g, 3msec 2. test: +/- x,y,z axis no electrical problem 6. regulatory this module is pre-scanned on module level to comply with following standards: ? us/can: fcc cfr47 part 15.247 ? japan: telec ? europe: ets 300-328 v1.6.1
ampak technology proprietary & confidential information 13 7. mechanical specification (sample figure) unit: mm tolerance: +/- 0.1mm
ampak technology proprietary & confidential information 14 8. recommended reflow profile referred to ipc/jedec standard. peak temperature : < 250 max reflow times : 2
ampak technology proprietary & confidential information 15 9. recommended footprint esd level of module: 1. esd-mm: jedec eia/jesd22-a115-a class a 2. esd-hbm: mil-std-833g method 3015.7 class1c unit: mm tolerance: +/- 0.1mm
ampak technology proprietary & confidential information 16 GM9601 10. package information 10-1 tray dimension
ampak technology proprietary & confidential information 17 10-2 packing information esd level of bag: 1. surface resistivity: interior : 10 9 ~10 11 ? / square exterior : 10 8 ~10 12 ? / square 2. dimension : 430 x 480mm 3. tolerance : 5.0mm customization label for customer request
ampak technology proprietary & confidential information 18 customization label for customer request 10-3 inner box unit : mm
ampak technology proprietary & confidential information 19 10-4 msl level / storage condition note : accumulated baking time should not exceed 96hrs 10-5 manufacture site: taiwan

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